The technical field of radiators specifically relates to a heat sink structure with TEC cooling fins. It includes a first heat sink and a second heat sink distributed on both sides of the main board. A semiconductor refrigeration fin is arranged between the upper surface of the main board and the first heat sink. It also includes a crimping buckle, and the crimping buckle is crimped and fixed on the outside of the first heat sink and the second heat sink. The crimping buckle includes a first clamping body and a second clamping body that are symmetrically arranged. The first clamping body includes a first substrate and a claw vertically fixed on the upper end of the first substrate. The second clamping body includes a second substrate and a claw vertically fixed on the lower end of the second substrate. A vertical chute is provided on the first base plate, and a screw is rotatably connected in the chute. A protrusion matched with the sliding groove is fixed on the second substrate, and the protrusion and the screw are screwed together. The rotating screw, the first clamping body and the second clamping body move up and down; the utility model can effectively solve the problems of time-consuming, labor-intensive, and low-efficiency assembly of the radiator structure in the prior art.
